InMojo Fabrication Support

It's one thing making a single prototype board, but building designs in the 10-15 board range can be very cost ineffective and labor intensive. By grouping several item orders together, we are able to help everyone produce high quality items at a much lower price than it would be to fabricate them individually.

We created our group fabrication system based on 3 principles:
• Simplify fabrication
• Keep costs as low as possible
• Allow anyone to create high-quality items

Get Started

We are accepting orders for as few as 20 pieces at a time.
To place an order or to learn more about order schedules and specific costs contact us at make@inmojo.com.

PCB Production Options Highlights

Rigid PCB Capacity

Type	Single-Sided PCB PTH Double-Sided PCB NPTH Double-Sided PCB Multilayer PCB (2~24 Layers)
Material Thickness	0.35mm - 6.4mm
Copper Thickness	Up to 6 oz Cu
Max Board Size	610 mm x 711mm(24' x 28')
Standard Surface Finish	Hot Air Solder Level
Alternative Finishes	Electroless Nickel / Immersion Gold Silver Electroless Tin Lead Organic ( OSP ) Hard Gold (edge contact) Carbon Peelable
Bare Board Test	Bed of Nails Simultaneous double-sided flying probe test
Solder Mask	Photoimageable Resist (with a wide range of colors)
Gold Plate	Edge connectors Touch Pads
Min. Via Size and Type	Dia.0.15mm(finished) Aspect Ratio=12;HDI holes(<0.10mm)
Min. Line Width & Spacing	0.10 mm/0.10mm(4mil./4mil)
Min. Via Hole Size and Pad	via:dia.0.2mm/ pad:dia.0.4mm;HDI<0.10mm via

Flexible PCB Capacity

Material	Polyimide (Kapton), Polyester (PET)
Number of Layers	1-2 layers, 1-4 layers
Min. Trace Width/Space	0.075mm(3 mil) for single-sided board 0.08mm (4mil) for double-sided board
Solder Resist	Laminating of cover film, Liquid sensitization solder mask printing ink
Bare Board Test	Bed of Nails Simultaneous double-sided flying probe test
Surface Treatment	Spray Stannum Tin and Sunk Stannum, Nickelplated Gold, Chemistry Turneric, Oxidation Protection (OSP)
Weldability	245+/-5 degree. 3-5s
Winding, Bending, Endurance	> 100,000 times
Thermal Stress Test	288+/-5 degree, 10s once
Rosh and E-testing	Yes

Aluminum PCB Capacity

Product Type	Al Clad PCB 1 layer
Copper Thickness	0.5oz, 1oz, 2oz, 3oz and 4 oz
Board Thickness	0.4mm To 4.0mm
Aluminum Machining	Drilling, Tapping, Milling, Routing, Die-Punching, break-off tab available
Min. Finish Hole Size	0.25mm
Min. Track Width	0.2mm (8mils)
Surface Finishing	HASL, HASL Leadfree, Immersion Gold, Flash Gold, OSP
Reference Standard	IPC-A-600G Class 2
Special Holes	Spot Facing, Cup Holes
Rosh and E-testing	Yes

Assembly Options Highlights

SMT Process

Max Board Size	330 * 250 mm
Min Components Size	0201
Component Range	0201 Chip-0.3mm Pitch QFP, BGA, CSP
Assembly Services	SMT, MI and ICT, AOI, X-ray, FCT, Wire Bond, COB

Discrete Process

Insertion Type	Lead Pitch	Min Board Size	Max Board Size
Axial	25	150 × 60 mm	508 × 371 mm
Radial	14.6	150 × 60 mm	330 × 250 mm
Jumper	8.4	50 × 40 mm	508 × 381 mm